Capabilities
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Specifications | Capabilities |
---|---|
Max Layer Count | 38 Layers (Details) |
Max Board thickness (mm) | 4.5mm ( 0.177”) (Details) |
Min Board Thickness (mm) | 0.25mm to 0.8mm (Details) |
Max PCB Size | 16 x 22” ( 406.4 x 558.8 mm) (Details) |
Min. Mechanical drill size (mm ) | 0.250mm (drill) - finished size 0.20mm |
Max. Aspect ratio | 10:1 |
Min. line/ space(mil) | 3.5mils |
Impedance control ( % ) | +/-10% |
Max. CU thickness, Inner layer (oz) | 70 microns standard, 105 microns on request |
Max. CU thickness, Outer layer (oz) | 105 microns start |
Min .Laser drill Size ( Micron) | 100 microns |
Min Hole / Pad Size (mil) | 8mil / 18mil |
Min. AR for micro via ( Micron ) | 3mils |
Surface Finish | HASL with Leaded ; ENIG (Metal Finishing) ; Hard Gold ; Selective Hard gold ; Immersion Silver; |
Via Filling | Yes (Details) |
Microvia hole filling technology | Yes (Details) |
HDI(Blind/Burried) | Yes (Details) |
Edge Plating / Castellation | Yes (Details) |
Depth control cavity | Yes (Details) |
Back Drilling | Yes (Details) |
Performance Class | IPC-Class-2, Class-3, Class-3A, JSS 52302, ISRO PAX 304 and customer QAP |
Solder Mask | Green ; Blue ; Red |
Silk screen | White with option of serial number printing |
V-Groove | Standard / Jump scoring |
UL Approval | Yes, File number E156972 |
ROHS/REACH Compliance | Yes – Except leaded HASL Finish |
Schedule | Min 4 Working Days |
Metal Bonding PCB | Yes (Details) |
High Tg/ Td | 170/260, FR4 High Tg, Arlon 35N , Polyimide , Megtron, others are available, need to discuss |
Low Dk / Df | Yes, Rogers 4000, 5000 and 6000 series, FR408, Tachyon, ITEQ168G,others are available, need to discuss |
Mixed dielectric | Yes |